Boards/Backplanes

Displaying 921 - 930 of 934

BGA pitch 0,200 mm

BGA pitch 0,200 mm
Somacis plant in Castelfidardo is very close to finish the tests that will break another barrier. The Italian headquarters are producing a test board that will use a BGA with a pitch of 0,2 mm. Something unbelievable till few years ago is very close to become a new starting point to further challenges. Key characteristics are very demanding for PCB, with BGA Pad diameter of 100 µm and tracks and gaps of 30 µm.
23rd August 2010

Open architecture backplanes, extenders and custom designs

Open architecture backplanes, extenders and custom designs
Verotec offers a wide range of standard backplanes and extender cards for VPX, VME, VME64, VXI and VXS applications, available as either stand-alone components, or integrated into thermally managed systems with subracks, enclosures and power supplies from its range. In addition to supporting VMEbus and its later derivatives, backplanes conforming to the requirements of cPCI, PCI, ATCA and microTCA are also produced, as are units for legacy applications such as STEbus and Multibus. Modified standard or fully custom backplanes are also available to meet specific customer requirements.
18th August 2010

Rogers Teams New RO4460™ Prepreg With RO4360™ Laminate For Matched 6.15-Dk Multilayer System Solution

Rogers Teams New RO4460™ Prepreg With RO4360™ Laminate For Matched 6.15-Dk Multilayer System Solution
Rogers Corporation (NYSE:ROG) has developed the perfect match for their popular RO4360™ laminate: RO4460™ prepreg. Both materials feature dielectric constant (Dk) of 6.15 ± 0.15 and low dielectric loss of 0.003 at 2.5 GHz. Together, they form an ideal system for fabricating compact, cost-sensitive multilayer high frequency circuits where space is at a premium.
4th August 2010


Molex extends Impact Backplane Connector System with two new configurations

Molex extends Impact Backplane Connector System with two new configurations
Molex Incorporated has released two additions to the Impact Backplane Connector System, its high-speed, high-density connector system for the telecommunication and data networking market. The Impact CoPlanar Connector System and Impact Mezzanine Connector System provide the ultimate flexibility to optimise designs for superior mechanical and electrical performance.
9th February 2010

AMCs as an add-on for MicroTCA systems

AMCs as an add-on for MicroTCA systems
Every interface and every signal transfer carries within it a potential source of error – not only on a technological level, but also in terms of interpersonal communication. This explains the desire of many developers and system integrators: To have to explain everything just once and then obtain as much as possible from just one supplier and from a single source. ELMA has therefore extended its product range to include “Integrated Products”. AMCs will now also be supplied for MicroTCA systems.
3rd December 2009

High-density 48-port UTP patch panel from Tyco

High-density 48-port UTP patch panel from Tyco
A new range of high-density UTP patch panels which require only 1U rack space has been introduced by the AMP NETCONNECT business unit of Tyco Electronics.
19th December 2008

PC/104 and PC/104-Plus connectors from In2Connect

At the beginning of the 90s the demand for electronic goods such as PCs was huge in all sectors. The performance of the embedded microcomputer application grew rapidly, as did, unfortunately, the problem of creating a low-cost connection between two motherboards. Industry had to find a way to connect at least two motherboards together without needing to use a card cage or a backplane. In addition, the components had also to be easily separated or replaced at any time.
4th June 2008

High density backplane connector family available from TTI

High density backplane connector family available from TTI
TTI, Inc has announced the Tyco Z-PACK TinMan Backplane Connector family, a cost-effective solution for customers searching for a high density, high performance backplane interconnect system. The Z-PACK TinMan connector design offers a fully protected right-angle receptacle for use on daughter cards where handling damage can be a concern when mating to a vertical male header.
2nd January 2008

Molex Signs Amphenol as Second-Source for Backplane Interconnect Family

Molex Signs Amphenol as Second-Source for Backplane Interconnect Family
Molex and Amphenol TCS (ATCS) have signed a cross license / second-source licensing agreement that gives ATCS the right to manufacture, market and sell the I-Trac Backplane Connector System worldwide. Molex is pleased to announce this latest development in the Molex-ATCS relationship,” said Martin Slark, Chief Executive Officer of Molex. “The technology behind our I-Trac design offers users unmatched versatility and performance. By partnering with ATCS we will be able to expand the availability of this leading technology throughout the industry.”
10th November 2007

Tern Microcontroller Boards available online

Great Western Microsystems has announced the availability of the complete range of Tern Microcontroller Boards from it’s new Online store – The Debug Store. Tern Microcontroller boards can now be ordered on-line complete with a wide range of available options for each board. In addition, complete Development Toolsets based on the industry standard Paradigm C/C++ development system can also be purchased, specifically customised for the Tern x86-based hardware.
5th October 2007


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