X-Ray inspection system’s Productronica debut attracts wide interest

Andy Bonner, European Operations Manager for YESTech Europe commented: ‘Visitors were particularly impressed by how simply the X-Series AXI could present a 2-D ‘slice’ through the hidden part of an inspected board, and by the clarity of the image produced. This effortless, automated inspection of areas that could not previously be viewed is due to YESTech’s unique 3-D tomosynthesis image gathering technology combined with easy to use programming software’

The X-Series machine features easy to use algorithms for detecting BGA soldering faults such as bridging, open circuit, or ‘head in pillow’ problems. These form part of the machine’s complete inspection capability for solder joints and other critical hidden features found in electronic assemblies, single and double sided PCBs and packaged semiconductors. Users can discriminate between the two planes of a double sided PCB for unimpeded automated inspection of solder joints, even where their density is high. The X-Series’ easy set-up is complemented by clear and precise results, so throughput is maximised with minimal false calls and operator fatigue.

During the show YESTech Europe received visitors seeking an in depth evaluation of the X-Series and its suitability for their production environment. Accordingly, the machine was transferred to one of the Group’s facilities in nearby Stuttgart immediately after Productronica to accommodate these requests, which originated from companies across Europe.