Viscom to Exhibit 3-D SPI Unit with SPI-AOI Uplink at the IPC APEX Expo

20th January 2012
Source: Viscom
Posted By : ES Admin
Viscom to Exhibit 3-D SPI Unit with SPI-AOI Uplink at the IPC APEX Expo
Viscom proudly announces that it will exhibit its recently introduced 3-D SPI system in Booth #2629 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California. The system is now available with the unique SPI-AOI Uplink feature that provides better defect detection during post-reflow AOI, ensuring the lowest false alarm rates.
Viscom’s S3088 SPI 3-D solder paste inspection system is based on the field proven S3088 platform, combining efficiency and user-friendliness.

Viscom’s S3088 SPI uses available highly accurate measurement data of the paste print to optimize post-reflow automatic optical inspection (AOI) at the end of the production line. SPI measurement data is typically only used to classify paste print, allowing high tolerances of up to +/-50 percent volume. Viscom’s new SPI-AOI Uplink feature enables the use of information later in the process to assure post reflow defect detection while allowing high variability of the paste print process.

The evaluation of process errors, such as marginal print results that are just below the defect threshold, provides valuable information about the expected solder joint quality. For every solder joint that is subject to post-reflow inspection, the volume, shape and position data of the corresponding solder paste deposit is made known to the AOI via the Uplink interface. This allows users to automatically adapt the post-reflow AOI inspection parameters according to the expected defect type. Too little paste volume often leads to open solder joints while solder bridges could be the product of excessive paste deposits. The consequently tighter classification of the AOI results in better defect detection while reducing false alarms.

Additionally, the depiction of paste images and additional data, together with AOI solder joint images at the post-reflow verification station, enhances the manual classification process.

Viscom’s AOI and SPI systems, as well as the results of a recent field study to verify the improvement through the SPI-AOI Uplink feature, will be presented at the show.

You must be logged in to comment

Write a comment

No comments

Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Connected World Summit 2019
22nd October 2019
United Kingdom The Business Design Centre, London
Hotspots Specials 2019
24th October 2019
Germany Böblingen, Germany
IoT Solutions World Congress 2019
29th October 2019
Spain Barcelona
Maintec 2019
30th October 2019
United Kingdom NEC, Birmingham
NOAH Conference 2019
30th October 2019
United Kingdom Old Billingsgate, London