Vicor To Showcase Its Latest ChiP Technology At PCIM Europe 2013

16th April 2013
Source: Vicor UK
Posted By : ES Admin
Vicor To Showcase Its Latest ChiP Technology At PCIM Europe 2013

Vicor will be exhibiting at PCIM 2013 in Nuremberg, the international conference and exhibition for power electronics and intelligent motion. Vicor will showcase its latest ChiP technology “Converter housed in Package”; a packaging technology that provides a high performance, scalable and cost-effective platform for advanced power components.

In addition, it will unveil the newest additions to its portfolio of high-performance, high-efficiency power management solutions and host demonstrations designed to showcase the latest innovations in power electronics from AC to the Point of Load.

Among the products in the spotlight will be Vicor’s Picor Cool-Power ZVS buck regulator product line for high-efficiency point-of-load DC-DC regulation and the recently announced user-defined, high-performance VI Chip PRM modules incorporating Vicor’s high-frequency ZVS buck-boost technology.

These customer-configurable VI Chip PRM modules can deliver up to 500 Watts at over 97% efficiency, at unprecedented power densities of up to 1,700 W/in3 (103 W/cm3).

PCIM attendees can visit Vicor in Hall 9 Stand 155. Vicor will also present two papers at the conference:

•Controlled-Bus Architecture with Voltage Equalization: a system approach to higher efficiency in low voltage DC distribution.

•Control of a Discontinuous-Conduction-Mode ZVS Buck-Boost Topology for Microprocessor Core Power.


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

embedded world 2019
26th February 2019
Germany Nuremberg
Wearable Tech Show 2019
12th March 2019
United Kingdom London
AMPER 2019
19th March 2019
Czech Republic Brno Exhibition Centre
LOPEC 2019
19th March 2019
Germany Messe Munchen
RF & Microwave 2019
20th March 2019
France Paris Expo, Porte de Versailles