Analysis

Test Interface Boards – Multitest Meets Today’s Fine-Pitch Requirements

12th October 2011
ES Admin
0
Multitest announces that the Santa Clara board fab has refined its pulse plating process to integrate it into Multitest’s fabrication process to further enhance the high aspect ratio capability. The integration is a result of the Santa Clara board fab anticipating the market trend for chip scale packages, particularly for fine-pitch array packages such as BGAs or LGAs.
Leveraging the advantages of its continually refined manufacturing process, Multitest now is able to build 0.3 mm through-hole constructions and boards with even higher layer count for high pin count, 0.4 mm fine-pitch array applications.

Multitest is known for leading drilling and registration competence. The company continues to invest in high aspect ratio via capabilities to continuously enhance the fine-pitch product offering.

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