STI Electronics Engineering Services Division to Exhibit at the Defense Manufacturing Conference

14th November 2012
Posted By : ES Admin
STI Electronics Engineering Services Division to Exhibit at the Defense Manufacturing Conference
STI Electronics will exhibit in Booth #601 at the upcoming Defense Manufacturing Conference (DMC), scheduled to take place November 26-29, 2012 at the Marriott Orlando World Center in Orlando, FL. STI’s Engineering Services division will feature its custom manufacturing for the defense sector, as well as counterfeit detection.
Additionally, the microelectronics lab specializes in state-of-the-art engineering design and assembly including current technologies such as Chip-On-Board (COB) and Multichip Module (MCM) as well as emerging technologies such as STI’s patented packaging technology coined Imbedded Component/Die Technology (IC/DT).

The Engineering Services division is a multifaceted technical organization that provides engineering support in the field of electronics manufacturing. From product design and manufacturability analysis to pre-production prototype and development, STI’s Prototype and Development Lab is a full service design review and pre-production facility.

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