Speedprint Announces Plans To Exhibit At FIEE Brazil 2013

28th March 2013
Posted By : ES Admin
Speedprint Announces Plans To Exhibit At FIEE Brazil 2013
Speedprint Technology will highlight the SP710avi with Advanced Dispense Unit, in distributor Hitech Electronica’s Booth J99 at the upcoming 27th International Electrical, Energy and Automation Industry Fair, scheduled to take place April 1-5, 2013, at the Anhembi Exhibition Centre, in Sao Paulo, Brazil.
##IMAGE_1_R##Speedprint prides the SP700avi for low ownership costs, simplicity, ease of maintenance and overall value. The advanced screen printer combines Speedprint’s commitment to high performance and reliability with all the necessary features for processing high technology substrates as standard equipment. The system was designed to cope with the rigours of high-volume SMT production while incorporating the flexibility needed in high-mix, quick product setup and changeover environments.



The SP700avi becomes the SP710avi when it is equipped with the Automatic Dispense unit. The Dual Syringe, Automatic Dispense unit allows users to eliminate additional capital outlay by integrating this functionally into the printer.



The ADu defines flexibility from its ease of programming through to calibration and cleaning. Utilizing the PCB Gerber file, an operator can simply drag any region of interest to automatically program volume deposits of paste or glue. There is no need to spend time on each deposit site adjusting to optimize the volume, point and drag. This means that a complete PCB can be programmed for production or prototype work in just seconds.

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