SN100C(551CT), the latest addition to the SN100C lead-free solder series, combines the benefits of a high reliability alloy (Sn-0.7Cu-0.05Ni+Ge) with a sustained activity core flux. The 551CT core flux is formulated for use with soldering tip temperatures up to 380°C while still retaining sufficient activity to ensure good tip separation. Compared with previous formulations, icicling is reduced by 90 percent and spattering by 95 percent. The silver-free SN100C alloy has a stable microstructure that can accommodate both the long-term cyclic strain and the impact loading to which solder joints can be subjected in service.
SN100C (551CT) has been developed specifically for sequential soldering and rework. Today, 12 years after its introduction, SN100C lead-free solder is still displacing SAC305 in many applications because of its high reliability, low copper erosion, and cost effectiveness.
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