SMT Hybrid Packaging 2013 With Interesting Emphasis

20th February 2013
Posted By : ES Admin
SMT Hybrid Packaging 2013 With Interesting Emphasis
Once again SMT Hybrid Packaging acts as a platform providing comprehensive information on innovations, products and solutions in the field of System Integration in Micro Electronics. From 16 – 18 April 2013 visitors will find well-known companies such as ASYS, Assembleon, AAT Aston, Heraeus, KSG Leiterplatten, LPKF and Yamaha in Nuremberg, Germany. Moreover, numerous first time as well as small- and medium-sized exhibitors will be present on the show.
Joint stand “Molded Interconnect Devices”

An insight into MID technologies will be provided on the joint stand organized by the German research federation 3D-MID e.V. Products and innovations in the field of Molded Interconnect Devices will be presented in a live production line as well as on a special forum.

EMS in focus

The exhibition also attacks this year on “Electronic Manufacturing Services” again. On one side, the joint stand Service Point EMS provides the chance to directly compare many EMS suppliers and highlights the growing importance of EMS-Services. On the other side the ZVEI will present his new brochure “The world of testing – definitely the desired quality” on Thursday, 18 April 2013 at the exhibition forum.

Tutorials on all three exhibition days

For the first time, the practical tutorials in English language will be offered on all three exhibition days. International experts from industry and science present current and future developments in electronics manufacturing, offer solutions for special problems and are inviting all delegates to discuss and to exchange their experiences. One tutorial takes half a day and leaves enough time to visit the exhibition during the same day. In addition the workshop “Additive Manufacturing - 2D and 3D printing for electronics manufacturing will tie in with the success of last year. The printed electronic topic will be presented full-time on Tuesday. The conference (held in German) will take place on two days and will include two hot topics. On Wednesday morning international specialists will present 3D Wafer Level Packaging – Highest Heterogeneous Integration Density, on Thursday morning, the topic “High Temperature Interconnects – Robust and Reliable” will be discussed.

More Highlights

Companies with special know-how in the field of Opto Electronics will be waiting for the visitors on the joint stand “Optics meets Electronics”. A diverse and professional supporting program will be presented on two forums, where Experts will inform the visitors about the latest trends and developments in panel discussions and vendor presentations.

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