Online toolbox to tackle thermals

5th December 2018
Posted By : Alex Lynn
Online toolbox to tackle thermals

For every ten degrees in junction temperature rise, the chances of your IC failing doubles. With megatrends like increasing power levels, shrinking PCB area, and smaller and smaller package sizes, how can you protect your design against heat and ensure long-term system reliability?

In the thorough training, from Texas Instruments learn about how to optimise your DC/DC switching regulator design for thermal performance. The LM73605/6 and LM76002/3 synchronous buck converters serve as the example devices. Topics discussed in the video include:

  • Packaging options and what to look for to maximise thermal performance.
  • Thermal resistance metrics from the datasheet and what they mean.
  • Calculating PCB area requirements for heat sinking.

To watch the video, click here.


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