Analysis

OK International to Hold Advanced Package Rework and Repair Seminar in Phoenix

27th March 2012
ES Admin
0

OK International today announced the location for its fourth Advanced Package Rework and Repair seminar. The technical seminar is scheduled to take place Tuesday, May 8, 2012, at the Hilton Phoenix Airport in Phoenix, AZ from 9 a.m.-12 p.m.

At this seminar, attendees will learn the latest techniques to rework and repair BGAs, QFNs and Micro SMDs. The seminar will feature rework demonstrations with real-life applications learned from global experiences.

Rick Talbot, Western Regional Sales Manager, commented, “We are excited to bring this series of rework seminars to the Phoenix area. This will give the local community a great opportunity to see the latest advancements in rework and repair technology on BGAs, QFNs and Micro SMDs.”

The seminar will include a 30-minute multimedia presentation, two hours of hands-on demonstrations and instruction, and a Question and Answer session to conclude. Be one of the first to see the new Metcal Scorpion Rework System in action. Limited space is available and the first 20 registrants will be admitted free of charge.

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier