AIM to Exhibit Range of Innovative Solutions at SMT Nuremberg 2012

AIM’s most robust solder paste, NC258, has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. NC258 reduces defects such as voiding and head-in-pillow. The superior wetting ability of NC258 results in bright, smooth and shiny solder joints. Additionally, the paste offers very low post-process residues that remain crystal clear even at the elevated temperatures required for today’s lead-free alloys.

Also featured at the show will be a popular no-clean spray flux, NC265LR. AIM’s alcohol-based NC265LR is a halide-free, no-clean liquid flux formulated to offer a very wide process window allowing for extremely good wetting, even to difficult-to-wet materials. NC265LR offers low post-process residues, is safe to be left on the circuit board and passes SIR in the raw state. NC265LR is extremely safe for rework and palletized wave soldering. This flux is compatible with a broad range of lead-free and tin-lead solder alloys.

In addition, the company will highlight its broad range of tin-lead and lead-free alloys including its SN100C, a lead-free solder alloy developed by Nihon Superior in Japan, offering user-friendly properties, high-throughput and the lowest cost of ownership in comparison to any other lead-free solder alloy.

For more information, please visit with company representatives in Hall 7, Stand 219 during this exhibition.