MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Toronto Expo and Tech Forum

19th April 2012
Posted By : ES Admin
MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Toronto Expo and Tech Forum
MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA Toronto Expo & Tech Forum, scheduled to take place May 16, 2012 from 10 a.m.-3 p.m. at the Crowne Plaza Toronto Airport Hotel in Ontario, Canada.
The MINIOVEN 04 provides a reflow environment in a compact, standalone unit and is ideal for pre-bumping QFNs and reballing BGAs and CSPs.

The efficient hot gas circulation ensures optimal heating of the component and a controlled reflow process. The unit offers programmable modes and will accommodate up to 99 profiles, with the ability to edit individual profiles and fine tune parameters.

A gas connection is available for processing gases, such as nitrogen, argon and formic.

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