on sensing devices are one of the MEMS industry’s hottest topics, and one reason is increased combo solution adoption. “Yole Développement expects the market for 6 and 9-axis sensors to grow from $598M in 2013 to $2.34B by 2018”, said Laurent Robin, Activity Leader, Inertial MEMS Devices & Technologies. With this in mind, successful players should take advantage of a technology optimized for cost and size reduction (i.e. with product platforms, new bonding technologies and less-demanding vacuum requirements) while allowing multi-sensor integration.
Last week, Teledyne DALSA Semiconductor, a Teledyne Technologies company and a world-leading
pure-play MEMS foundry, announced the availability of its new MIDIS 200mm MEMS fabrication platform for motion sensing devices. MIDIS™ provides high-volume, low-cost accelerometer and
gyroscope manufacture, or the integration of both into an Inertial Measurement Unit (IMU), thereby addressing the increased demand for inertial sensors in consumer (mobile), automotive and
During this webcast, attendees will learn about this 200mm MEMS technology’s key features. Teledyne DALSA will detail how MIDIS™ allows accelerometers, gyroscopes and combo-sensors to be integrated in a very compact, hermetic wafer-level package which can be wire bonded or solder bumped. The company will also highlight how a high vacuum can be maintained in the package cavity, allowing resonator Q factors in excess of 20,000 without the need for expensive getters.
The MIDIS™ platform was successfully deployed to alpha customers and is now being released to a
wider market. This live webcast occurs on June 27 at 8.00 AM PDT. To register, please visit the “Upcoming Webcasts” section of the I-Micronews.com website, or click MIDIS™.
Featured speakers include:
Luc Ouellet, Vice President of Technology Development, Teledyne DALSA Semiconductor
Laurent Robin, Activity Leader, Inertial MEMS Devices & Technology, Yole Développement