Analysis

Meet OK International in Rochester for Its Next Advanced Package Rework and Repair Seminar

8th May 2012
ES Admin
0

OK International today announced that it has added another Advanced Package Rework and Repair seminar to its schedule. The next technical seminar is scheduled to take place Thursday, June 7, 2012 at the Rochester Institute of Technology (RIT) in Rochester, NY.

The seminar will feature rework demonstrations with real-life applications learned from global experiences. At this seminar, attendees will learn the latest techniques to rework and repair BGAs, QFNs and Micro SMDs, and an opportunity to see the new Metcal Scorpion Rework System in action

Ed Zamborsky, Eastern Regional Sales Manager, commented, “We have had a great relationship over the years with the RIT Center for Electronics Manufacturing and Assembly, and appreciate their support in bringing this popular rework seminar to the region. This will give the local electronics assembly manufacturing community a great opportunity to see the latest advancements in rework and repair technology on BGAs, QFNs and Micro SMDs.”

The seminar will include a 30-minute multimedia presentation, two hours of hands-on demonstrations and instruction, and a Question and Answer session to conclude. Limited space is available and the first 20 registrants will be admitted free of charge.

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier