t on a low power 65-nm process featuring embedded Flash technology, MachXO2 devices provide designers of low density PLDs an unprecedented mix of low cost, low power and high system integration in a single device. These devices are ideal for low power applications such as smart phones, mobile computing, GPS devices and digital cameras, and for control PLD applications in end markets such as telecom infrastructure, computing, high end industrial and high end medical.
“Designers of consumer applications are faced with the increasing challenge of delivering new standards and features within a short time-to-market window,” said Shantanu Dhavale, Senior Product Marketing Manager for Low Density Solutions. “The MachXO2 Pico Development Kit provides designers with a flexible and low cost platform to rapidly evaluate and verify their designs in hardware.”
About the MachXO2 Pico Development Kit
The MachXO2 Pico Development Kit features the MachXO2 LCMXO2-1200ZE device, 1 Mbit SPI Flash, I2C temperature sensor, an expansion header for JTAG, SPI, I2C and GPIO interfaces, an LCD display and capacitive touch sense buttons. Using the preloaded Environment Scanning system-on-chip (SOC) design provided with the development kit, designers can now optimize power using multiple operating modes that are typical of low power consumer applications. They can also test, within minutes, popular interfaces such as UART, SPI, I2C and LCD control using the integrated 8-bit LatticeMico8™ microcontroller in conjunction with the MachXO2 Embedded Function Bock (EFB). Designers can then build their own designs using the free downloadable reference design source code, implementing these features in less than an hour.
The MachXO2 Pico evaluation board can be powered up using a battery or a USB cable. The development kit includes a USB cable for device programming and QuickSTART documentation.
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