The growing complexity of electronic assemblies increases the cleaning challenge due to miniaturization, lower component gaps, and improved flux designs. The need to remove ionizable contaminants is critical to production yields and reliability. As user’s source cleaning equipment and cleaning agents to meet these increased cleaning demands, a number of options must be considered such as batch versus inline, cleaning agent designs, impingement options, controlling the cleaning agent, rinsing, drying, and waste management.
The purpose of the research paper is to provide operational data for integrating aqueous cleaning equipment and cleaning agent for maximum performance. The conference participates will gain knowledge of batch and inline aqueous cleaning equipment designs, cleaning agents, energy sources for penetrating low residue gaps, air management, controlling the cleaning agent, managing rinse water, and waste management. This paper was co-written by Dr. Mike Bixenman, CTO of Kyzen Corporation, Dirk Ellis, Engineering Service Manager and Wayne Raney, Process Engineer also of Kyzen.
Serge Tuerlings has a degree in Petro Chemistry. He started his career in the electronics industry nearly 20 years ago, working in Printed Wire Board manufacturing and supplying surface treatment solutions to the European market. After five years, Serge moved on to work in the soldering industry by joining one of the leading suppliers of soldering materials.
Tuerlings quickly became an expert in soldering matters and has presented several papers during various events. He joined Kyzen two years ago and started the company’s European support and logistics facility. Serge’s analytical mind and vast experience in the electronics assembly industry has helped Kyzen to expand its European operations.