KIC Will Highlight Automated Thermal Process Tools at SMT/Hybrid/Packaging

19th March 2013
Source: KIC
Posted By : ES Admin
KIC Will Highlight Automated Thermal Process Tools at SMT/Hybrid/Packaging

KIC will exhibit in Booth #7-419 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany. The KIC RPI helps manage reflow ovens to consistently maximize the desired results.

In addition to automatically profiling each and every PCB, the RPI provides process deficiency information in order to help users correct defect issues quickly. The RPI is an automatic system that, once programmed, works in the background without any operator involvement. Additionally, the KIC RPI improves quality and throughput, and is universally applicable because it is independent of the oven model, production lines, personnel, PCB types, and even factory.

The ProBot automatically verifies whether each PCB is processed to specification in the reflow oven. The suspect PCBs are identified and may be isolated. One method to enhance the use of an X-ray system is to have these boards then be sent off to batch X-ray. Since the typical batch X-ray machine only inspects less than one percent of all assembled PCBs, the ProBot allows for a more effective sampling.

The X5 Profiler redefines what a data intelligence profiler can and should do. As opposed to the data acquisition profilers that focus purely on recording a product profile, a data intelligence profiler takes the additional active role of suggesting new oven setup in order to optimize the thermal process. The X5 ships standard with process optimization software that enables the user to improve his or her process along three dimensions:
• To position the profile in the center of the process window
• To maximize conveyor speed
• To reduce the oven’s electricity use while running a deep in-spec process


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