Four New Pavilions at NEPCON China 2012 to Shine Spotlight on Key Industry Issues

10th January 2012
Posted By : ES Admin

Four new pavilions — Touch Screen Manufacturing, Advanced Electronics Packaging, Electronics Manufacturing Automation and ESD — will be debuted at the 22nd edition of NEPCON China, which will be held at Shanghai World Expo Exhibition & Convention Center from April 25-27, 2012. One of the most influential electronics manufacturing and SMT trade events in Asia, NEPCON China is the trusted barometer of the local electronics manufacturing industry. The new pavilions will highlight development trends in China’s electronics manufacturing equipment sector. They also will facilitate debates on pressing issues surrounding the production of electronics.

Michiel Kruse, Vice President of Reed Exhibitions East China, said, “We are truly committed to boosting the development of the electronics manufacturing industry. That is why we keep innovating our NEPCON events: to provide our customers with an excellent, highly rewarding show experience. In response to emerging issues in electronics manufacturing, NEPCON China 2012 will introduce four new pavilions geared towards satisfying the requirements of all participants.”

Recent statistics show that the output value of global touch screens reached USD 13.4 billion in 2011 and is expected to grow to USD 23.9 billion by 2017. Today, China is a key touch panel manufacturer. Both Japan and Taiwan have recently made significant investments into building production bases on the Chinese mainland, to capitalize on the nation’s advanced manufacturing technologies.

The sustained expansion of China's touch screen market leaves ample room for growth. As one of the major attractions at NEPCON China 2012, the Touch Panel Manufacturing Pavilion will feature various chemical raw materials, accessories, manufacturing equipment, test machines, driver ICs and other parts needed to make touch screens. The showcase will be a good opportunity for exhibitors to demonstrate new technologies and products. It will also give them the opportunity to network with the highest profile businesses in the industry.

The Advanced Electronics Packaging Pavilion is a response to calls for miniaturization, high performance and low costs for semiconductor components. The pavilion will feature semiconductors, LED lights, power devices and other cutting-edge packaging technologies, as well as assembly machines, packaging materials, components, analysis and simulation software used for IC packaging, various packaging systems, semiconductor devices, test machines, plating/etching and MEMS packaging. The pavilion will be the ideal platform on which to source the best technological solutions and learn about emerging market trends.

Across the world’s most energetic electronics manufacturing hubs, costs, particularly for labor, are on the rise. The same is true in the rapidly developing Chinese electronics manufacturing industry. Demand for highly efficient, flexible equipment has fueled the popularity of automated technologies across the electronics production line.

The Electronics Manufacturing Automation Pavilion will display the most advanced industrial automation technologies and products used to make electronics. It will include robotics, motion control equipment, automatic equipment, parts, carriers, tools, assembly system materials, quality control devices, laser equipment and more. This pavilion is the only channel devoted to providing automation solutions for manufacturers of electronic products and suppliers of electronics manufacturing equipment.

In 2012, the Antistatic Solution Exhibition for electronics manufacturers in China will feature solutions for making manufacturing, packaging, and transportation safer, more reliable and more effective. The theme, Antistatic Protection Technologies in the Micro SMT Era, will facilitate the exploration of the establishment of a S20.20 system and an antistatic protective area. There will also be a dedicated EPA area that will feature standard ESD protective products, test methods and management technologies.

The China ESD Summit Forum 2012, organized by the Shanghai Electrostatic Protective Industrial Association, will examine the theoretical and practical elements of the latest ESD concepts and technologies from across the world. Participants will be able to engage with industry experts face-to-face to resolve the ESD challenges related to practical application. They’ll also be able cut the rejection rate of electronic products.

Green Lighting Shanghai 2012, co-organized by the CSA and Reed Exhibitions, will run concurrent to NEPCON China. The event will highlight the results of scientific research conducted along the entire length of the lighting industry chain, including new manufacturing equipment, materials, product applications and solutions. By sharing resources with NEPCON China, Green Lighting Shanghai 2012 is set to attract even more visitors from the LED field.


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