Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

17th January 2013
Posted By : ES Admin
Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO
Finetech will highlight the FINEPLACER core rework system in booth #1205 at the upcoming IPC APEX EXPO, scheduled for February 19-21, 2013 at the San Diego Convention Center in California. The FINEPLACER core offers proven rework technology for a wide spectrum of SMT components, ranging in size from 0201 to 70 x 70 mm BGAs, and handling PCBs up to 310 x 400 mm.
The semi-automated design includes force measurement with automatic component lift-off and placement. A real time process observation camera allows the ability to view the reflow process at almost any angle. The FINEPLACER core represents a compact, yet versatile hot-gas rework system withs a level of professionalism that exceeds its attractive price.

The system integrates the complete rework cycle into an efficient design without diminishing functionality. The FINEPLACER core handles de-soldering, site dressing/solder removal, paste print, re-balling and component replacement in one integrated platform. Driven by sophisticated integrated thermal management and the new QuickStart Profile Library, the FINEPLACER core provides more for less.

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