Analysis

ESSEMTEC to Highlight a Range of Leading-Edge Technologies at SMT Hybrid Packaging 2013

11th April 2013
ES Admin
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Essemtec announces that it will exhibit numerous flexible Swiss-made solutions in Booth 7, Hall 211 at the SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
For years, Essemtec’s FLX was the world’s most popular pick-and-place machine for flexible SMD production. Many specific customer applications were solved using the FLX and a wide range of options and accessories have been designed for the platform. Now Essemtec introduces FLEXUS, which builds on the proven concepts of the FLX and expands the potential due to a new, modern H-drive. This minimizes maintenance and increases the working surface. The footprint of the FLEXUS is only 25 cm larger than the FLX, but it offers twice the placement space and a 30 percent higher feeder capacity. Additionally, a new state-of-the-art software was developed that includes all popular features of the predecessor software Easyplacer. FLEXUS can easily be integrated in existing FLX production lines. Due to the similar software environment an additional training for FLX operators is not required. The MIS software for the set-up planning, stock management and traceability is incorporated, as well as the existing feeder (up to 240) and placement programs. FLEXUS can place up to 6,000 cph precisely with automatic fiducial identification, laser and vision centering. It also can place all SMD components from 01005 up to 50x50 mm with component heights varying from 0 to 20 mm.

The Paraquda pick-and-place system combines a large feeder capacity (up to 240 intelligent electronic hyQ feeders pickable from all four sides), fast programming and changeover while the machine is running, with the ability to quickly place any component from 01005 up to 3.15 x 2.75 (80x70 mm) including fine-pitch, BGA, CSP or flip chips. The Paraquda now is available with a dispensing option, which allows it to dispense up to 20,000 glue or paste dos per hour. The new dispensing option provides the Paraquda pick-and-place with all the features of a modern dispensing machine, including a needle height calibration station and a fully automatic needle cleaning system. It can be equipped with a time-pressure or a screw dispensing valve. The new dispenser option extends the Paraquda’s SMD placement capability with glue and paste dot dispensing, simplifying logistics because multiple assembly operations can be concentrated on a single machine. Additionally, the option can spare the investment for additional dispensing equipment, saving both money and space.

The Cobra is the world’s most modern SMD pick-and-place machine. With an extraordinarily large feeder (up to 240 hyQ feeders), the Cobra offers the most feeders per sqm in the market. With a maximum board size of 600x800 mm and a component range from 01005 to 80x70 mm, the Cobra offers a wide range for all production purposes. Additionally, using the intuitive ePlace user interface, operation and programming become easy tasks.

The PANTERA-XVC is designed for prototype and mid-size series manufacturing. The machine offers an ideal combination of speed, accuracy and wide application range, and is capable of placing 4,500 components per hour. The machine features optical laser and vision centring, and can place all SMD components from 0201 up to 2 x 2 (50x50 mm). PANTERA-XVC’s top-down vision system recognizes fiducial marks automatically. It can be used for teaching and controlling after dispensing and placement. The large feeder capacity and the automatic identification of the intelligent feeders minimize changeover time and guarantee quality. All tape feeders are electrically driven and feeding pitch is programmable.

Also on display will be Essemtec’s new PC-TF16, PC-TF16-24 & PC-TF32-44 hyQ feeders for the pick-and-place machines Cobra and Paraquda. With an indexing time of only 60 ms, they increase the machine’s placement speed by more than 25 percent and allow for four components to be picked up simultaneously. The new feeders can be used for 16, 16-24 and 32-44 mm tape widths, thereby maximizing the usage of every feeder.

The Scorpion fully automatic dispensing system sets new standards in dispensing technology. Due to advanced technologies, the Scorpion can dispense up to 120,000 dots per hour (DPH) with an accuracy of 51 μm (3σ). The high speed dispenser is equipped with the most modern, accurate systems that drive and steering technology offer today. The Scorpion is available in two versions – standalone or inline. The easy programming and operation allow for the use of a wide range of dispensing applications, including adhesive dispensing, encapsulation, dam and fill, underfill, LED cavity fill, coatings, sealings and other applications.

At this year’s SMT the Scorpion system will be shown the first time operating with the new eDis-software at Vermes Microdispensing GmbH’s booth located in Hall 6, Booth 306. eDis software is designed entirely by Essemtec and is based on the company’s eez-technology. It has been fully developed in .net, uses an integrated database and offers a modern, interactive, intelligent and intuitive tool for controlling all parameters. Scorpion’s new software allows a 15-20% higher dispensing speed, depending on the application. Additionally the customer gets a medium database which is continuously supplemented.

Tucano is a high precision, fully automatic inline stencil printer featuring auto-setup functionality for quick, error-free setup and changeover. Tucano features a unique double camera vision system with no moving parts or mirrors. Automatic inspection and cleaning systems are integrated. Tucano's exceptional user guidance software is easy to learn. Due to its small footprint, the Tucano can be integrated easily into a fully automatic SMT line. Tucano features a unique design with only one XY-drive for vision, PCB stopper, stencil cleaning system, stencil load and unload, and 2D inspection. The special design increases the reliability of the printer and simplifies maintenance.

Essemtec also will exhibit its semiautomatic printer with vision, the Fino, which is more than adequate for small to mid-size volumes. Intelligent control and the possibility for an alignment per two vision cameras combines high quality technologies within a small footprint with a 17.7 x 19.7 (450 x 500 mm) printing area. The printer accepts any size stencil frame up to 23 x 23 (584 x 584mm) and offers quick changeover.

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