Basic Packaging Workshop - Event Details Announced

10th June 2011
Source: IMAPS-UK
Posted By : ES Admin
Basic Packaging Workshop - Event Details Announced
UK Microelectronics Packaging Society (IMAPS-UK) is pleased to announce details its forthcoming “Basic Packaging Workshop being held at TWI (The Welding Institute) on 21 & 22 June 2011.

Selection of the correct joining process and materials for advanced electronic device packaging (Microelectronic, Semiconductor, PV etc.) is critical for electrical functionality, mechanical integrity and overall reliability.

The Basic Packaging Workshop will provide delegates with an insight into this grounding breaking technology, its business drivers and assembly techniques from the specialists: “IMAPS-UK”, the United Kingdom Chapter of the International Microelectronics & Packaging Society.

Day one is a Technical Seminar providing presentations on various aspects of the technology and day two is a hands-on practical workshop giving introductory training on two selected topic areas – Wire bonding and Epoxy Adhesives.

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