Analysis

CommAgility DSP module for ATCA and MicroTCA systems

3rd October 2013
Nat Bowers
0

CommAgility have announced a high performance processing board in the mid-size Advanced Mezzanine Card format, the AMC-2C6678L. With 16 DSP cores and shared memory, the new module is ideal as a DSP accelerator or front end processor in AdvancedTCA systems, where it can provide the horsepower required for a range of high performance applications including image sensor processing, voice/video, telecoms and stepper control.

The AMC-2C6678L is also well suited to use in MicroTCA chassis, or standalone with suitable power and cooling.

The module includes two of the latest Texas Instruments TMS320C6678 fixed- and floating-point octal core DSPs, which run at 1.25 GHz core speed, giving a combined performance of 320 GFLOPS and 640 GMACS.

Fast, flexible I/O includes Serial RapidIO to the backplane for high bandwidth data transfers. PCI Express and Gigabit Ethernet interfaces use on-board switches for maximum flexibility and access to all DSPs on the card, while the SRIO link is directly connected to one DSP and shared using Hyperlink.

4GB of high bandwidth DDR3-1600 SDRAM is provided as standard, with 2GB for each DSP. A separate 128MB of flash memory is also included, which can be used to store DSP boot code.

Available software includes full board support libraries for the DSPs, and an IP stack with Telnet/TFTP for Ethernet-based board control and upgrade. 3L Diamond is available for additional control and management of multiple tasks across all 16 DSP cores. Additional debug support is provided via on-board serial port connectors, plus RS-232 and JTAG debug via the CommAgility AMC-BB Debug Breakout Board.

The new module is a mid-size, single width PICMG AMC.0 R2.0 AMC. Further customisation is possible in volume, to enable the best technical and commercial fit to a customer application.

The AMC-2C6678L is available now. For pricing, please contact CommAgility.

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier