AIM’s Karl Seelig to Discuss Overcoming Challenges of QFNs at SMTAI 2011

Over the past several years, handheld device designers and manufacturers have been driven by consumers to fit more functionality into smaller packages. Due to the demand for these devices, the electronics assembly industry has seen a decrease in the available space on these assemblies as well as an increase in their density. In response to these demands, there has been a steady increase in the use of packages known as Quad Flat Pack No Lead (QFN).

This presentation will review the common challenges of QFN implementation and determine the keys to overcoming these issues. It will discuss how the stencil design, solder powder particle size, solder paste volume and stencil thickness all play a significant role in successful implementation of the QFN.

In his more than 30 years of industry experience, Karl has written and presented numerous technical papers on topics including lead-free electronics assembly, no-clean flux technology, assembly and process optimization, inspection, and metallurgical studies. Mr. Seelig serves as the Chairman of the IPC Solder Products Value Council and has been involved in the development of material specifications under IPC. He also has received numerous patents in soldering technology, including four lead-free solder alloys.