ACD Material Coordinators and Operators Are IPC-A-600 Certified

6th July 2011
Posted By : ES Admin
ACD Material Coordinators and Operators Are IPC-A-600 Certified
ACD (Automated Circuit Design), a leading supplier to the electronics industry, announces that all of the company’s material coordinators and machine operators are IPC-A-600 certified. The certification demonstrates ACD’s commitment to continuous quality improvement.
“We believe a strong preventive quality policy lowers the demands on in-process and final quality control. It is not unusual for the kitting operation to be 600 trained, but it is for the machine operators. We give them the capability to inspect along with the authority to stop the lines if they see a suspect bare board,” commented W. Scott Fillebrown, President & CEO.

The IPC-A-600 certification provides ACD’s material coordinators and machine operators with the information required to provide high-quality incoming inspection. Knowing acceptable conditions means that PCBs are not needlessly scrapped; knowing nonconforming conditions saves the assembler from an expensive component mounting operation.

For many years, the IPC-A-600 Acceptability of Printed Boards document has set the standard for PCB/PWB workmanship quality. The IPC-A-600 gives comprehensive acceptance criteria with full-color illustrations and photographs showing all types of printed board surface and internal conditions. Because of its importance to both the PWB manufacturer and assembler, the IPC-A-600 has become one of the most widely recognized and used documents ever published by IPC.

IPC developed the IPC-A-600 Training and Certification Program to promote a consistent body of knowledge regarding printed board end product requirements to all segments of the electronic interconnection industry.

ACD is a leading supplier to the electronics industry based in Richardson, TX. Founded in 1984, ACD’s services comprise complete board layout services, ATE engineering services, DFM/DFA capability, printed circuit fabrication, component procurement, SMT and through-hole build, rework, X-ray, flying probe and functional test, and development.


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