Analysis
Innovative Surface Engineering Conference to be hosted by NanoKTN and CEMMNT
The Nanotechnology Knowledge Transfer Network (NanoKTN), one of the UK’s primary knowledge-based networks for Micro and Nanotechnologies, and CEMMNT (The Centre of Excellence for Micro and Nano Technologies), are pleased to announce their High Performance Thin-Film Coatings conference which will highlight solutions to key issues in surface engineering of high performance thin film coatings.
Express Logic Earns 100 Million Club Membership
Express Logic, Inc., the worldwide leader in royalty-free real-time operating systems (RTOS), today announced that it has been inducted into VisionMobile’s “100 Million Club,” in recognition of the deployment of its ThreadX RTOS in over 500 million mobile handsets—more than five times the minimum entry level—as of the first half of 2010.
All of electronica 2010 in a single app!!!!
Smart phones are now an important part of everyday life. As well as making calls etc, they can be useful in all walks of life thanks to more than 200,000 applications: first-aid tips, recipes, navigation at sea or as a spare key for the car - the possibilities are endless. With the EasyExpoNavigation application, visitors to electronica 2010 can now also use their cell phone as a trade fair companion.
picoChip is first baseband company to support new LTE femtocell APIs
picoChip today announced that it is the first company to support the newly announced Femto Forum LTE application programming interfaces (APIs). The new APIs help developers of LTE femtocells integrate subsystems from different suppliers reducing integration cost and time, and accelerating development of femtocells and other ‘small cell’ basestations which are critically important for LTE network deployment.
Renesas Demonstrates its Commitment to the Industrial Market
Renesas Electronics, formed in April this year from NEC Electronics and Renesas Technology, hosted an Industrial Open Day conference in Barcelona on the 14th-16th October 2010. This unique event, organised in cooperation with NEC LCD Technologies, brought together over one hundred and twenty five market-leading companies and allowed them to experience the latest technology developments from Renesas Electronics, thus providing a platform for conti...
Hitachi TFT display modules on show at Electronica 2010
Hitachi Europe Ltd, Display Products Group (DPG) will be represented at the Electronica 2010 trade show by local distributors. Data Modul and Glyn will be exhibiting Hitachi’s leading-edge In-Plane-Switching (IPS) LCD technology and Hitachi’s recently introduced range of value added LCD display solutions featuring performance enhancing glass bonding technology.
Gresham Power Electronics wins Major Defence Contract
Gresham Power Electronics, the Salisbury based MIL and Commercial power conversion specialist has been awarded a major contract to supply specialist battery charging equipment and batteries for new submarines for India. The contract will last until 2016 and is valued at some £540,000.
Telemis announces PACS integration with 3D post-processing imaging software from leading vendors
Telemis Group, the medical imaging company specialized in PACS (Picture Archiving and Communication System) solutions, has unlocked new freedoms for healthcare authorities to combine efficient image-management using the Telemis-Medical PACS with best-in-class visualization and workflow software from all major vendors.
Photon Energy To Install 1.23MW Solyndra Project in Prague
Solyndra announced that Photon Energy has signed an engineering, procurement and construction (EPC) agreement for a 1.23 MWp Solyndra project and begun installation on multiple rooftops in Prague, Czech Republic. Novacento a.s. obtained the permission to install solar systems on these roofs which are primarily school and nursery buildings. The project is the largest Solyndra installation in Eastern Europe.
Texas Instruments opens the company’s first semiconductor manufacturing plant in China
Texas Instruments today announced its first wafer fabrication facility, or “fab,” in China. This important milestone puts manufacturing close to the company’s growing customer base there. Located in the Chengdu High-tech Zone (CDHT), which is considered by many to be China’s next major technology hub, TI Chengdu will further expand TI’s analog production capacity.