Analysis
Agilent Technologies Secures Patent for Porous Shell LC Particle Manufacturing Technology
Agilent Technologies Inc. (NYSE: A) today announced that it was awarded a U.S. patent for the process used to apply the superficially porous shell to particles in Agilent Poroshell 120 high-performance liquid chromatography (HPLC) columns.
Cypress Extends Deadline for First Phase of ARM Cortex-M3/PSoC® Design Challenge
Cypress Semiconductor today extended the deadline for it’s ARM Cortex-M3/ PSoC 5 Design Challenge. In order to accommodate exceptional demand, participants now have until January 24, 2011 to complete stage one of the challenge. The design challenge aims to find the most innovative and useful designs from the millions of possibilities available to designers using the Cypress PSoC 5 architecture powered by the ARM Cortex-M3 processor.
NXP Appoints Jeff Palmer as Vice President, Investor Relations
NXP today announced the appointment of Jeff Palmer as Vice President, Investor Relations, reporting directly to Karl-Henrik Sundström, Executive Vice President and Chief Financial Officer. Palmer joins NXP having worked in the semiconductor and financial industry for over 25 years, most recently serving as Vice President, Investor Relations for Marvell Technology Group.
NXP Announces Industry’s First Integrated CAN Transceiver Microcontroller Solution
NXP Semiconductors (Nasdaq: NXPI) today announced the LPC11C22 and LPC11C24 – the industry’s first integrated high-speed CAN Physical Layer transceiver and microcontroller with easy-to-use on-chip CANopen drivers. Offered as a unique System-in-Package solution, the LPC11C22 and LPC11C24 with integrated TJF1051 CAN transceiver combine complete CAN functionality into a low-cost LQFP48 package.
STMicroelectronics Advances Easy-Access Microcontroller Development with Third-Generation Platform – Delivering Extra Flexibility Plus Cost Savings
STMicroelectronics is leading the trend to simplify product design with plug-and-play modules for prototyping, by releasing its third-generation development platform for customers using STM8 and STM32 microcontrollers.
Going back to basics with modern phone design for the home
Cambridge Consultants, a leading technology product design and development firm, has helped Punkt, a Swiss consumer electronics startup to bring their elegant DP 01 phone to market. Designed by leading industrial designer Jasper Morrison, the DP 01 is a DECT phone re-invented for simplicity and intuitive functionality. Using its considerable expertise in helping start-ups with new product introduction, Cambridge Consultants helped Punkt to select...
Link Microtek expands SMT team with appointment of Chaxu Lad
Link Microtek, the Basingstoke-based specialist in RF, microwave and infra-red technologies, has recently expanded its surface-mount product team with the appointment of Chaxu Lad as sales engineer covering central and northern England.
Nihon Superior’s President Tetsuro Nishimura to Present at INTERNEPCON JAPAN 2011
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that company President Tetsuro Nishimura will present a paper titled “Recent Developments in the Application of Sn-Cu-Ni+Ge Lead-free Solder and Halogen-free Fluxes” at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan. The presentation will take place during session INJ-2, titled...
Synopsys Announces Production-Ready Lynx Design System Optimized for Common Platform 28-nm High-K Metal Gate Technology
Synopsys announced it is delivering a low power, high-performance system-on-chip (SoC) design solution optimized for the Common Platform alliance (CPA) 28-nanometer(nm) high-k metal gate (HKMG) technology. Based on Synopsys' Lynx Design System and its Galaxy™ Implementation Platform-enabled flow with Synopsys DesignWare Interface IP, this solution was built through a multi-year collaboration with ARM and the Common Platform alliance [IBM, Samsu...
iPower Event Announces A “Call-For-Papers”
The UK Microelectronics Packaging Society (IMAPS-UK) has announced a call for papers and abstracts for their forthcoming “iPower” event which is intended to ‘Showcase UK Power Electronics’. The event will be held on 30 November & 1 December 2011 at the University of Warwick’s prestigious IDL Conference Centre.