Analysis
Aegis Unveils the Industry’s First iPhone / iPad Application for Manufacturing Operations at SMT 201, Nuremberg
Aegis Software unveils its next industry-first technology in the form of the only iPad and iPhone integrated manufacturing software system for electronics assemblers.
Atmel Launches Capacitive Touch Controllers With Integrated Haptic Effects
Capacitive touch application-specific microcontrollers for implementing touch Button, Slider and Wheel (BSW) functionality integrating Immersion's haptic intellectual property (IP) to create a more intuitive and powerful user experience
Haivision's Growth in 2010 Marks Another Record Year
Haivision, a leading provider of the most advanced video networking, digital signage, and IP video distribution solutions, today announced that 2010 represented yet another record-breaking year for the company. Haivision realized a 45-percent increase in revenue over 2009. Its remarkable growth was driven by the release of market-focused solutions and the expansion of its worldwide sales, support, and engineering teams.
Sentec wins Queen’s Award for the second year running
Sentec, the smart grid specialist and product development company, has been recognised with the Queen’s Award for Enterprise for Innovation. This is the second year in a row that the company has been honoured with a Queen’s Award.
INSIDE Secure licenses advanced ARM SecurCore technology
INSIDE Secure today announced its intention to provide 32-bit secure processor solutions based on the industry-leading ARM architecture. Under the terms of a licensing agreement with ARM, INSIDE can now utilize the ARM SecurCore SC300 processor for its next generation of secure payments, digital security and NFC solutions.
Do Engineering with National Instruments UK & Ireland Technology for Academia Webcast Series
National Instruments UK & Ireland has launched an exciting new Technology for Academia webcast series about the latest NI tools and technologies that enable educators, researchers and students to ‘do engineering’. This four-part series will take place between 23rd and 27th May.
Renesas Electronics to Sell its U.S. Semiconductor Wafer Fabrication Facility to TELEFUNKEN Semiconductors
Renesas Electronics Corporation and TELEFUNKEN Semiconductors GmbH & Co. KG today announced that they have signed an agreement under which Renesas Electronics America Inc. will sell its semiconductor wafer fabrication facility in Roseville, California, to TELEFUNKEN Semiconductors International LLC, a company that includes TELEFUNKEN Semiconductors GmbH. The sale price is approximately 53 million U.S. dollars, and the closing for the sale is plan...
Sysgo and OpenSynergy Join Forces For The Automotive Market
SYSGO AG and OpenSynergy GmbH have signed an exclusive cooperation agreement targeting the automotive market. They will join forces to provide carmakers with a software platform that already meets both avionics safety standards and AUTOSAR (Automotive Open System Architecture) requirements. Rolf Morich, general manager at OpenSynergy, said in a joint press release, “The high quality standards of SYSGO’s technology enable us to provide a unive...
Taiwanese LED Company – FZLED - Going Global
FZLED are announcing their plans to enter multiple international markets around the world and begin offering several lines of high-performance LED products to consumers. Receiving ISO-9001:2008 certification in November, 2010, FZLED is already turning heads with their innovative products like their newly released on/off switch dimming T8 LED Tube Lights.
SmartKem Receives Investment Funding To Continue Innovative Development
SmartKem Limited, the developer of novel, printable organic semiconductor materials and ink formulations for flexible electronics, today announced it has received investment funding from the Porton Capital Group and Finance Wales Investments Limited. The investment allows SmartKem to further develop its flexible printed electronics solutions.