Vere, Managing Director Bond Test said, “We’re delighted to receive the award. This technique opens up a range of tests previously not possible – with a very simple, fast test procedure within the new Paragon™ software. It is recognition of the hard work and dedication of our development team.”
The new Nordson DAGE 4000Plus Hot Bump Pull system is a totally industry unique solution, conforming to IPC-9708 as well as JEITA ET-7407A. It is fully integrated into a single load cartridge on a standard 4000Plus system. Heating and cooling stages and a pin clamping mechanism are integrated into the single load cartridge.
The 4000Plus Bondtester represents the new industry standard in bond testing with unsurpassed data accuracy and repeatability. Nordson DAGE bond test technology meets the requirements of emerging test applications including ribbon pull, pad cratering using hot pin pull, bend and fatigue testing. The 4000Plus bondtester uses the next-generation Paragon™ software providing semi-automatic test routines, automatic GR&R calculation, unique database search engine wizard and superior data reporting.
Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.