InStrip® test handler is designed for high parallel tri-temp test of devices in substrate strips or lead frames over a complete temperature range. The modular and scalable concept of the InStrip® supports different customer requirements to ensure a good return on investment.
The same platform can be extended to test and calibrate MEMS devices in strip form by incorporating an optional MEMS test module. These sensor application-specific InMEMS test modules can be converted for various package types. The MEMS sensors are stimulated during test and contacted row-by-row with an integrated indexing mechanism supporting high parallel testing. Various sensor test applications already have been successfully installed at test floors, e.g. InGyro, InPhone, InFlip, InMagnet and InPressure.
The Multitest InCarrier™ leverages this concept of high parallel test for singulated packages as well, and offers a reliable, cost-efficient high parallel test handling solution for the smallest devices.