Sensors

Value added sensor assembly solutions from Honeywell

15th August 2013
Nat Bowers
0

Honeywell has today launched new customizable pressure and thermal sensor solutions – including modules with multiple sensors and technologies integrated inside. Enabling design engineers to more easily, affordably and faster find a Honeywell sensor solution that meets their design parameters, additional value add options include custom interfaces, I/O, size and shape, environmental packaging, and total thermal management solutions.

Heaters, magnetic, Magneto-resistive, infrared, optical, pressure, thermal, and humidity options are all available for customization.

With Honeywell’s upfront and ongoing technical support, this customization process enhances the developer design process. This ensures that new and updated designs can be brought to the market quicker. The ability to design in a customized version of an already approved sensor design often means that device developers do not have to re-certify their upgraded products. This results in significant savings for both time and money.

Valerie Rothermel-Nelson, Honeywell senior global product marketing manager, comments: “It is important to provide customers with exactly what they want, all from a single vendor. This is part of Honeywell’s new systematic method of providing integrated and differentiated value added solutions.  Our new approach means that we are now providing higher level assemblies, not just components.  A higher level assembly is a package that provides differentiated and integrated solutions that ultimately give our customers a competitive advantage. It could be combining more than one sensor into higher level packaging, providing custom termination or even providing total thermal management solutions.”

Honeywell’s value-added capabilities build on highly reliable, proven and accurate sensing platforms, while responsive quoting and rapid prototyping processes meet demanding deadlines.

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