Digital pressure sensors reduce design & manufacturing costs

18th August 2015
Source: Honeywell
Posted By : Nat Bowers
Digital pressure sensors reduce design & manufacturing costs

Claimed to be one of the smallest amplified digital pressure sensors in the industry, Honeywell has unveiled its Amplified Basic Pressure (ABP) sensor. Designed to help engineers design systems that fit on increasingly smaller and lower power devices, the ABP sensor features wet-media compatibility, as well as sleep mode and temperature output options. This makes it a versatile choice for IoT applications.

Measuring 8x7mm, the ABP sensor’s small size will help engineers significantly save board space and reduce design and manufacturing costs, while maintaining enhanced performance and reliability of the systems they design.

The ABP sensors will be among the most accurate of their kind with a ±1.5% total error band and capable of reading pressure ranges from 60mbar to 10bar (6kPa to 1MPa or 1 to 150psi). This will enable engineers to better optimise system performance by improving resolution and system accuracy.

The ABP sensor will simplify installation by minimising the need for additional components and engineering time to design the sensor into the application. The sensor is available in both analogue and digital output I2C or SPI.

The sensor’s moisture sensitivity level of one will allow for unlimited shelf life when stored under 30°C/85% RH. Under most storage conditions, this allows for the sensor to be soldered onto the PCB without concerns about solder joint quality due to ageing of the sensor terminals, minimising the concern about ageing of the terminals prior to assembly to the PCB.

Dan Herzog, Product Line Director, Honeywell, commented: "Low power systems and the ‘Internet of Things’ are expanding into many industries. As a result, engineers have more pressure now to develop not just smarter, but smaller systems to fit these emerging trends. Our amplified digital basic pressure sensors were designed to help engineers meet these aggressive design goals by saving valuable space and cost without compromising the end product’s performance.”


You must be logged in to comment

Write a comment

No comments

Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

22nd November 2017
Rwanda Kigali
SPS IPC Drives 2017
28th November 2017
Germany Nuremberg
Cyber Security - Oil, Gas, Power 2017
29th November 2017
United Kingdom London
AI Tech World
29th November 2017
United Kingdom Olymipa, London
Maker Faire 2017
1st December 2017
Italy Rome