V.I Chip, Inc. introduces 120 W ‘half-chip’ bus converter with >800 W/in3 power density

The VIB0101THJ uses a Sine Amplitude Converter (SAC™) for a high power density of 840 W/in3. The half inch square ‘half-chip’ package enables a low impedance interconnect to the system board and reduces the power system volume by 75 % vs. similar power-level converters. The V.I Chip package provides flexible thermal management through its low junction-to-board and junction-to-case thermal resistance. The BCM’s low impedance SAC enables a 16x capacitance reduction – eliminating the need for limited-life aluminum electrolytic or expensive tantalum bulk capacitors. The bus converter increases overall system efficiency and lowers operating costs compared to conventional approaches.

The small size and high power density of this new 120 W high-efficiency BCM gives power designers new options and is the first of the new half-chip products offering layout flexibility, minimized power converter footprint and an easy design for fast time-to-market.

The BCM bus converter package is compatible with standard pick-and-place and surface-mount assembly processes.