AC/DC front-end module offers high power density

The VIA PFM is five times thinner than traditional 1U supplies, offering unique design advantages to power system architects challenged by size constraints. A 9mm thin profile and 36mm width enables the VIA PFM to be mounted on the sidewall of any typical 1U chassis, saving valuable real estate. Thermally adept VIA PFMs may be chassis mounted and conduction cooled to eliminate fans, thereby improving overall system reliability and further minimising the power system footprint. High density, high efficiency and low thermal resistance make VIA PFM front-end modules suited for a wide range of end-market applications, including small cell wireless base stations, size constrained LED lighting applications, industrial and automation systems.

VIA power modules enable power system designers to create highly dense, efficient, flexible and scalable power systems. Vicor’s 9mm thin VIA power modules integrate system functions including EMI filtering, transient protection and inrush current limiting to reduce design time and design risk. Available in chassis-mount and PCB-mount configurations, VIA power modules support a multiplicity of mechanical mounting and thermal management options.

Vicor’s online PowerBench design tool suite enables designers to model a complete AC to PoL power system with a modular power component design methodology. The PowerBench tool suite provides the ability to quickly configure and visualise end-to-end power systems and dynamically analyse system performance, accelerating design cycles and reducing development costs.

VIA PFM front-end power modules are available from Vicor and authorised distributors with prices starting at $107 for OEM quantities.