Power
IGBT power modules cut conducting, switching losses
Vishay Intertechnology has introduced five new half-bridge IGBT power modules in the newly redesigned INT-A-PAK package.
Innoscience at APEC 2024: new GaN ICs and datacentre tech
Innoscience Technology, the company founded to create a global energy ecosystem based on high-performance, low-cost, gallium-nitride-on-silicon (GaN-on-Si) power solutions, is attending the upcoming IEEE Applied Power Electronics Conference and Exposition (APEC) 2024.
Imec debuts high-speed ADC, leads in efficiency
At this week’s IEEE International Solid-State Circuits Conference (IEEE ISSCC2024), imec, a global research and innovation hub in nanoelectronics and digital technologies, introduces a breakthrough architecture that lays the foundation for a whole new generation of analog-to-digital converters (ADCs)
P-DUKE add compact 50W unit to their medical AC/DC range
P-DUKE has expanded its medical-grade open-frame power supplies portfolio with the addition of the new MAD50 series, ranging from 15W to 450W.
310% loss reduction in piezoelectric IC conversion achieved
University of California San Diego and CEA-Leti scientists have developed a piezoelectric-based DC/DC converter that unifies all power switches onto a single chip to increase power density.
New portfolios from TI push the limits of power design
Texas Instruments (TI) has introduced two new power conversion device portfolios to help engineers achieve more power in smaller spaces, providing high power density at a low cost.
Panasonic Industry unveils ZV series
Panasonic introduces the new ZV Series, an advanced Electrolytic Polymer Hybrid capacitor.
How to deliver current beyond 100A to an ADAS processor
The electrification of vehicle systems is growing in advanced driver assistance systems (ADAS), which include vision analytics for autonomous driving, parking assistance, and adaptive control functions. Smart connectivity, safety-critical software applications, and neural network processing all require enhanced computing power in real time.
Picocom powers Wave Electronics Open RAN equipment
Picocom has announced that Wave Electronics designed Picocom’s PC802 system-on-chip (SoC) into its latest Open RAN product, the WEH47-TM24B radio unit (O-RU).
Firecomms to exhibit at APEC
Firecomms, a global specialist in plastic optical fibre (POF) transceivers and fibre optic solutions, combining state-of the-art compound and silicon semiconductor technology with inventive small-scale integration, will exhibit at the 2024 IEEE Applied Power Electronics Conference (APEC) in Booth #2035 at the Long Beach Convention Centre 25–29 February 2024.