Toughened Two Part Epoxy Adhesive/Sealant Meets NASA Low Outgassing Specifications and is Cryogenically Serviceable

It withstands cryogenic temperatures and meets NASA low outgassing specifications. This versatile system is used for a wide variety of structural, electronic, aerospace, medical, and oil & chemical processing applications. EP21TDCHT-LO has a convenient mix ratio of 1:1 by weight or volume and is formulated to cure at room temperature or more rapidly at elevated temperatures.

As a toughened system, EP21TDCHT-LO is particularly well suited for bonding dissimilar substrates, especially when they have differing coefficients of expansion. It has an outstanding service temperature range from 4K to +350ºF. Other notable features include a shear strength exceeding 2500 psi, a peel strength of greater than 20 pli, and a Shore D hardness of greater than 60. The cured epoxy has excellent chemical resistance and is an electrical insulator.

Parts A and B are available in half pint, pint, quart, one gallon and five gallon containers.