Thermally Conductive Adhesives Keep Their Cool

14th January 2011
Posted By : ES Admin
Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today's electronic circuitry.
In tandem with the great growth of the technological sector comes the need for a new generation of innovative, highly advanced solutions capable of reliable performance in the ever increasing temperatures of electronic devices. Master Bond's white paper examines the challenges design engineers face as chip makers up the ante on microprocessor power and density, and how thermally conductive adhesives and potting compounds can manage heat while solving other application issues.

Available downloads


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

SPS IPC Drives 2016
22nd November 2016
Germany Nürnberg Messe
electronica 2016
8th November 2016
Germany Messe München
European Microwave Week 2016
3rd October 2016
United Kingdom ExCel London
1st Executive Infrared Imaging Forum : From Niche to Large Vol...
8th September 2016
China Shenzhen Convention & Exhibition Center