Thermal gap filler combines high thermal performance with softness for high-end applications

17th July 2008
Posted By : ES Admin
Thermal gap filler combines high thermal performance with softness for high-end applications
Chomerics Division Europe has introduced a new thermal interface pad that combines excellent thermal performance and easy compression in high-end gap filling applications in the computer and telecom markets. THERM-A-GAPTM 976 is electrically non-conductive and has a thermal conductivity of 6W/m-k. The material is available in thicknesses of 1mm to 5mm.
THERM-A-GAP 976 is an unsupported boron nitride filled silicone elastomer. The extremely soft nature of the material, which has a Shore A hardness of just 10, allows it to conform to mating component surface irregularities under low compression forces; this helps to minimise the stress on components.

Available in sheets or custom die-cut parts, THERM-A-GAP 976 is the highest thermal performance and softest material in the family that also includes Chomerics’ THERM-A-GAP 974 and THERM-A-GAP G974 thermally conductive gap filling pads. THERM-A-GAP 974 has a thermal conductivity of 5W/m-k and is available in thicknesses of 0.5mm to 1.50mm. THERM-A-GAP G974 has an added fibreglass carrier to provide improved mechanical resistance and has a thermal conductivity of 4W/m-k. Both 974 materials can be supplied with a pressure sensitive adhesive to aid assembly.

All three materials have an operating temperature range of -65ºC to +150ºC and are RoHS compliant.

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