Pending

Intertronics - LED-curable adhesives for medical device assembly

23rd November 2010
ES Admin
0
Intertronics specialize in adhesives for high-tech, high-performance industries such as medical device assembly companies, so they are particularly pleased to announce a complete system of UV adhesives and LED curing from technology partner DYMAX specifically with assembly of medical devices in mind.
DYMAX UV adhesives cure upon exposure to light. Their ability to cure in seconds enables faster processing and greater output resulting in lower processing costs.

Explained Peter Swanson, M.D. of Intertronics: “The combination of the DYMAX LED Prime UVA Spot Curing Lamp and complementary adhesives which cure quickly brings all the benefits of LED-based curing lamps to the medical device manufacturer. This new high-intensity lamp offers many advantages over conventional spot-curing systems, including no consumable bulbs to change, no warm-up, cool cures, and constant intensity for thousands of hours. This unit produces the highest power of any LED spot-curing lamp on the market today, with an output of >15W/cm².”

In particular, Intertronics engineers have found two adhesives are well paired with the BlueWave LED Prime for ultra-fast cures. They are designed for rapid bonding of a wide variety of the plastics typically used in the manufacture of medical devices such as reservoirs, tube sets, port fittings and drug delivery systems. The fast cure and limited heat emitted by the BlueWave LED Prime provides an ideal system for heat-sensitive substrates, where thin walls may be subject to warping or stretching.

DYMAX 1020-M Ultra Light-Weld® adhesive is ultra fast, tack free and visible/UV light curable in less than two seconds. The complementary 1120-M-UR Ultra-Red™ is not only ultra fast/tack free, but when cured also fluoresces bright red under low-intensity black light. The bright red fluorescence contrasts extremely well on plastics that naturally fluoresce blue in colour, and greatly assists with visual inspection on bond-line areas.

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier