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Farnell’s innovative biodegradable packaging wins Environmental Product of the Year

28th April 2010
ES Admin
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Farnell announced that its unique biodegradable packaging has won Environmental Product/Service of the Year at the UK's Sustainability Live Environment and Energy Awards, fighting off competition from more than 60 entries. The judging panel was highly impressed with the exciting new packaging solution, a first for the electronics industry, which was implemented by Farnell in September 2009, to replace polythene packaging for an estimated 3.6 million orders despatched from the company’s European warehouses each year.
The unique packaging, which is capable of breaking down in an industrial composter, or dissolving simply in hot water, uses patented technology, exclusive to Farnell, to fully biodegrade without releasing any harmful chemicals into the environment, while offering the same level of component protection as standard static dissipative bags.

Polyvinyl Alcohol (PVOH) - widely recognised for its soluble characteristics that have been used to prevent the spread of infection in Healthcare and Agriculture - was identified for its anti-static properties and the environmental benefits it presented for the Farnell business and the wider electronics industry. Recognising its suitability, the company patented and developed the product further in collaboration with packaging specialist Antistat.

Commenting on the win, Paul Horton, Director of Supply Chain Farnell Europe, said: “we are absolutely delighted with the recognition provided to Farnell with this industry leading award. Farnell is committed to social responsibility, recycling over 80% of our own waste in the UK, we are now working to extend that commitment and assist our customers in reducing the waste that they send to landfill.”

John Hensley, Managing Director of Antistat said: “Farnell’s innovation in the environmental space is a great example of a leading business’s commitment towards being responsible. We are proud to have been associated with Farnell throughout the development stage and share the delight in receiving the Product of the Year award.”

With plans already in place to roll out the new packaging to its warehouses in Asia and the US, Farnell have also offered the packaging available for sale to electronic design engineer customers via its 40 global websites and are leveraging relationships with leading component manufacturers for them to use this environmentally-friendly alternative. Several global manufacturers have already expressed interest and are currently looking into specifications to meet their own business requirements.

In addition, the product is now undergoing further development by the company to understand how the material can be used to support our industry in the future and reduce the impact that the electronics industry has on the environment.

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