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TI introduces industry’s most highly integrated piezo haptic driver

21st July 2011
ES Admin
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Ultra-fast start-up time and wide driving capabilities enable quick, flexible tactile feedback implementation in consumer and industrial applications

Texas Instruments introduced the most highly integrated piezo haptic driver for mobile consumer and industrial designs. The DRV8662 features an integrated 105-V boost converter, power diode, and 50-V to 200-V peak-to-peak (Vpp) fully-differential amplifier, resulting in a solution size that is 50 percent smaller than leading competitors. The DRV8662 also lowers total solution cost by 40 percent compared to competing solutions, thanks to an efficient, transformer-less design. With the capability to drive a wide range of piezo actuator voltages and fast start-up time, the DRV8662 benefits designers creating fast, high-definition haptic designs.



“Realistic tactile feedback effects considerably enhance the overall user experience of touch-enabled consumer electronics devices,” said Steve Anderson, senior vice president of TI’s High Performance Analog business. “The integration of the DRV8662 haptics driver makes it easy to include effects like localized vibrations and frequency variations in both touch screen-input devices and those without a touch screen, from mobile phones and tablets to computer accessories, home appliances, and industrial automation consoles.”



Key features and benefits:

•Piezo modules enable fast start-up time (1.5 milliseconds), thin form-factor and high bandwidth, resulting in the production of haptic effects not possible with intertial-based actuators.

•Drives piezo actuator capacitances from 50 to 680 nanofarad (nF) at 300 Hz, enabling a wide variety of high-resolution haptic effects, including feedback localized to specific areas of the device, as well as vibrations and pulses that change in frequency based on how the user is interacting with the device.

•Transformer-less design and wide supply range of 3.0 to 5.5-V with direct battery connection reduces solution size and cost.

•Thermal overload protection prevents damage when the device is overdriven.



Availability and pricing:

The DRV8662 is available now in a 4-mm x 4-mm x 0.9-mm QFN package, priced at $1.75 in quantities of 1,000.



Tools and support:

An evaluation module is available for the DRV8662, priced at $100, and includes a fully-programmable MSP430G2553, as well as analog and digital interfaces for complete standalone and in-system evaluation. Out of the box, the MSP430 is programmed with sample haptic waveforms for immediate evaluation. To view more information, including reference material and sample code, and to place an order, visit http://www.ti.com/drv8662evm-pr.



A simulation model for the DRV8662 is also available in TINA-TI 9.1, a SPICE-based analog simulation program. Download TINA-TI 9.1 at www.ti.com/tina-ti-download-pr.



OMAP compatibility

The DRV8662 can be used with TI’s OMAPTM family of processors in touch screen-enabled devices, such as handsets. The processing power of the OMAP devices, coupled with the high-definition haptic effects enabled by the DRV8662, significantly improve the user experience.



Learn more about the DRV8662 and haptic technology by visiting the links below:

• Order DRV8662 samples and evaluation modules: www.ti.com/drv8662-preu.

• Watch a Q&A series with a TI haptics expert about implementing piezo haptics solutions: www.ti.com/drv8662video-pr.

• Get technical support and connect with fellow engineers on the TI E2ETM Community: www.ti.com/touchforum-pr.



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