Conduction-cooling assemblies take the heat out of VPX, VME and CompactPCI boards

17th November 2011
News Release from: Schroff UK Ltd
Written by : ES Admin
Conduction-cooling assemblies take the heat out of VPX, VME and CompactPCI boards
Now available from electronics packaging specialist Schroff is a range of conduction-cooling assemblies (CCAs) that have been designed specifically for use in VPX, VME and CompactPCI systems. As well as removing the heat from PCBs where convection alone is insufficient, the CCA devices also provide mechanical support for the boards to enable them to withstand conditions of severe shock or vibration.
Manufactured by Birtcher, one of Schroff’s sister companies within the Pentair Technical Products Group, the CCAs are available in 3U and 6U sizes in a choice of configurations compatible with VPX, VME/VME64x and CompactPCI boards. In addition, they can accommodate and cool ccPMC or XMC mezzanine cards.

With the CCA attached, the heat generated by the electronic components on a PCB is transferred through the board to the CCA frame and then on to the chassis. The CCAs incorporate high-performance 5-wedge retainers, which lock the frame into the card guide to provide a high clamping force with even pressure distribution for low thermal resistance.

They are supplied with either a backing plate or backing strips, and their integral extractor handles provide ample force to easily disengage high-contact-density board connectors.
Particularly suitable for use in defence, aerospace, transportation and industrial systems, the Birtcher CCAs are made from aluminium alloy to minimise weight and can be specified with black anodised, chemical film or electroless nickel finishes.

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