BTU International to Exhibit New Features of PYRAMAX Solder Reflow Oven at NEPCON South China 2011

22nd August 2011
Posted By : ES Admin
BTU International, a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, will showcase its new Dual Lane Dual Speed capabilities of the PYRAMAX™ solder reflow system, as well as next-generation HE Flux Management, in Booth #1F42 at the upcoming NEPCON South China 2011, scheduled to take place August 30-September 1, 2011 in Shenzhen, China.
A new Dual Lane Dual Speed solder reflow system, plus HE Flux Management will be highlighted at the show.

PYRAMAX reflow ovens set the industry standard for thermal performance, providing electronics manufacturers with the highest throughput to compete successfully in today’s challenging marketplace. At NEPCON South China, new advances in productivity will be highlighted, allowing customers to maximize their operations.

Dual lane reflow ovens have been used for years to increase production in a single reflow oven by allowing two boards to be run at the same time in parallel, usually with identical or nearly identical boards. Now by using independent lane speeds it is possible to run boards with significant differences, simultaneously. Additionally, the HE Flux Management system further extends maintenance cycle and is easy to maintain with automated feedback of servicing requirements.

BTU’s exclusive closed-loop convection control provides precise heating and cooling control, constant heat transfer, maximum process control, and low nitrogen consumption, result in the lowest cost-of-ownership in the industry. PYRAMAX is the industry’s most versatile performer and its best value.

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