ProTek Devices beefs up computing circuit protection products

17th May 2016
Posted By : Jordan Mulcare
ProTek Devices beefs up computing circuit protection products

ProTek Devices has introduced two circuit protection components that shield a variety of networking, mobile and other computing applications from the destructive effects of electrical transients. The GBLC03CIDNHP is an ultra-low capacitance (0.6pF typical) transient voltage suppressor array (TVS array) available in a bidirectional configuration. The SRV25-4LC is a port protection array that also boasts ultra-low capacitance (1.0pF typical).

ProTek Devices’ GBLC03CIDNHP is suitable for Ethernet 10/100/1000 Base T, smartphones and other handheld wireless systems, and USB interfaces. It is rated at 500W for an 8/20μsec waveshape. It meets various IEC standards requirements. This includes 61000-4-2 (ESD): air - 15kV, contact - 8k, exceeding level 4, and handles 10kV contact and 25kV air discharge. It also includes 61000-4-4 (EFT): 40A - 5/50ns and IEC 61000-4-5 (surge). The GBLC03CIDNHP also offers low leakage current and is a suitable replacement for MLV (0805) devices. It protects one power or I/O port and provides ESD protection of > 25kV as well as a low clamping voltage.

The SRV25-4LC is suitable for ESD protection in Gigabit Ethernet, smartphones and other similar portable electronics, video card interfaces, USB 2.0 interfaces, and DVI interfaces. It can clamp the effects of electrical fast transients on the power bus. The SRV25-4LC combines eight low-capacitance steering diodes for up to four individual data or transmission lines and one TVS diode for power bus protection. It meets the same IEC standards as the GBLC03CIDNHP. The SRV25-4LC offers 400W peak pulse power per line (typical = 8/20μsec). ESD protection is > 25KV and it also provides a low clamping voltage. Both devices are RoHS and REACH compliant.

The GBLC03CIDNHP is provided in a molded JEDEC DFN-2 package with an approximate weight of only 0.8mg. The SRV25-4LC is offered in a molded JEDEC DFN-10 package, which minimises lead inductance to prevent overshoot voltages during high ESD current events. Its approximate weight is just 7mg. Both devices feature lead-free pure-tin plating (annealed) and a solder reflow temperature of (pure-tin - Sn, 100) 260-270°C. Both parts also have a UL 94V-0 flammability rating and are provided in 8mm tape and reel, per EIA standard 481.

The GBLC03CIDNHP is available in minimum quantities of 5,000 and the SRV25-4LC is available in minimum quantities of 3,000. Pricing varies and interested parties should contact ProTek Devices or an authorised distributor for details. Representatives are available worldwide including, the UK, USA, Asia and more.


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