Micros

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Single-chip module speeds system design

Single-chip module speeds system design
A new and exclusive single-chip system module (SCM) has been developed by Arrow Electronics and NXP Semiconductors. It simplifies the use of NXP’s i.MX 6 applications processor in IoT devices, wearables and smart-home technology, where space is tight, energy is precious and time-to-market is critical.
26th June 2017

SEGGER introduces compact version of J-Link for verification & test beds

SEGGER introduces compact version of J-Link for verification & test beds
The compact variants of the J-Link models are designed for minimal footprint and to mount securely and unobtrusively into development or end user equipment.
 Two mounting holes and small size make it simple to place the J-Link into existing equipment housings or to reserve space for direct-to-PCB mounting. The compact J-Link models enable fixed setups to be deployed using identical features, behavior and specifications of the corresponding market-leading J-Link models.
22nd June 2017

MCUs increase performance while reducing power consumption

MCUs increase performance while reducing power consumption
Microchip has announced a new family of eXtreme Low Power (XLP) technology 32-bit MCUs. The PIC32MX1/2 XLP family offers current PIC32MX customers an easy migration path to achieve higher performance at much lower power, enabling both increased functions and longer battery life in portable applications. The PIC32MX1/2 XLP family increases performance in small pin-count devices with little code rework for existing customers.
21st June 2017


XLP MCUs provide ample battery life for compact applications

XLP MCUs provide ample battery life for compact applications
Microchip has announced new PIC32MM 'GPM' microcontrollers (MCUs). These eXtreme Low Power (XLP) MCUs feature large memory in small packages to provide ample battery life for space-constrained applications. With the inclusion of several connectivity options, Core Independent Peripherals and feature-rich development boards, the 'GPM' MCUs are well suited for digital audio applications, gaming/entertainment devices, IoT sensor nodes and portable medical devices.
20th June 2017

The highest inductance in the industry's smallest package

The highest inductance in the industry's smallest package
Coilcraft has introduced its new 0201HL Series of chip inductors available in seven inductance values ranging from 22 to 51 nH, the highest currently offered in a wirewound 0201 package. This inductance range is fully optimised for impedance matching in 700 MHz LTE and 5G applications. The 0201HL Series also provides the highest Q factors currently available in that package size — up to 62 at 2.4 GHz.
19th June 2017

Chipset simplifies design of robust automotive solutions

Chipset simplifies design of robust automotive solutions
Global microelectronics engineering company, Melexis, has announced a new Time-of-Flight (ToF) chipset and development kit that enables simple, modular and future proof design of 3D vision solutions. Previously available only as part of a development system, the chipset is now available to designers everywhere. The newly available chipset includes the MLX75023 1/3-inch optical format ToF sensor and the MLX75123 companion IC that embeds many of the external components normally required to develop a 3D vision solution.
16th June 2017

Development kits target voice-enabled speakers

Development kits target voice-enabled speakers
Supplier of voice solutions for IoT products, XMOS, has announced the launch of the XVF3000 family of voice processors, which provide far-field voice capture using arrays of MEMS microphones. With optional support for Sensory’s TrulyHandsfree technology, XMOS claims that the XVF3000 family provides the most flexible and cost effective always-on voice interface in a single device. XMOS also announces the availability of the VocalFusion Speaker development kit (XK‑VF3100‑C43), which includes an XVF3000 processor card and a 4-mic circular microphone array.
16th June 2017

MCUs spend more time in standby, save power

MCUs spend more time in standby, save power
The MSP430FR599x and MSP430FR596x microcontrollers, the latest MSP430 microcontrollers from Texas Instruments (TI) are now being shipped by Mouser Electronics.. The ultra-low-power, ferroelectric random access memory (FRAM) microcontroller portfolio targets a wide range of sensing and measurement applications.
13th June 2017

8-bit microcontroller slashes footprint by up to 50%

The MC9S08SU 8-bit microcontroller from NXP Semiconductors is in stock at Mouser Electronics. This single-chip device for 4.5V – 18V motor control applications delivers high performance with tight integration to help lower BOM costs and reduce footprint by up to 50% for space-constrained applications.
12th June 2017

Synopsys VC Formal standardised for faster verification

Synopsys has announced that as their formal verification solution for advanced microcontroller designs, STMicroelectronics selected and standardised on Synopsys VC Formal.
9th June 2017


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EPE 2017 ECCE Europe
11th September 2017
Poland Warsaw
DSEI 2017
12th September 2017
United Kingdom ExCeL, London
RWM 2017
12th September 2017
United Kingdom NEC, Birmingham
Productronica India 2017
14th September 2017
India Pragati Maidan, New Delhi
Industry of Things World 2017
18th September 2017
Germany Berlin Congress Center