Memory

Modules integrate NAND chips fabricated with 19nm technology

4th November 2013
Staff Reporter
0

Toshiba have today unveiled a 32-gigabyte embedded device which integrates four 64Gbit (equal to 8GB) NAND chips fabricated with 19nm second generation process technology. Measuring only 11.5 x 13 x 1.0mm, it also comes with a dedicated controller.

This new product launch meets the growing demand for large density NAND flash memory chips that can support high resolution video and deliver enhanced storage. This demand is particularly true in the area of embedded memories with a controller function, which minimize development requirements and ease integration into system designs.Fulfilling this demand, the 128GB module can record up to 2,222 hours of music at a 128Kbps bit rate, 16.6 hours of full spec high definition video and 38.4 hours of standard definition video

THe is compliant with JEDEC e・MMC Version 5.0, published by JEDEC in September, and achieves a high read/write performance by applying the new HS400 high speed interface standard. Toshiba will bring the NAND chips to a line-up of single-package embedded NAND flash memories in densities from 4GB to 128GB. All will integrate a controller to manage basic control functions for NAND applications. Further to this, the e•MMC V5.0 compliant interface handles essential functions, including writing block management, error correction and driver software. It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products.

The new product is designed for application in a wide range of digital consumer products, including smartphones, tablet PCs and digital video cameras. Mass production will start from the end of November.

 

New Product Line-up

 

Product Name

Capacity

Package

Mass Production

 

THGBMBG8D4KBAIR

32GB

153Ball FBGA

End of November, 2013

 

THGBMBG7D2KBAIL

16GB

153Ball FBGA

End of November, 2013

 

Following 16GB and 32GB products, Toshiba will release 4GB, 8GB, 64GB and 128GB products in turn.

Key Specifications  

Product Name

THGBMBG8D4KBAIR

THGBMBG7D2KBAIL

Interface

JEDEC e•MMCTM V5.0 standard

HS-MMC interface

Capacity

32GB

16GB

Power Supply Voltage

  1. ~3.6V         (Memory core)

  1.7V~1.95V / 2.7V~3.6V  (Interface)

Bus Width

x1 / x4 / x8

Write Speed

90MB per sec.

(Sequential/HS400 Mode)

50MB per sec.

(Sequential/HS400 Mode)

Read Speed

270MB per sec.

(Sequential/HS400 Mode)

270MB per sec.

(Sequential/HS400 Mode)

Temperature Range

-25degrees to +85degees Celsius

 

Package

153Ball FBGA

153Ball FBGA

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