Low-Power Advanced Memory Buffer

10th May 2007
Source: IDT
Posted By : ES Admin
Low-Power Advanced Memory Buffer
IDT (Integrated Device Technology, Inc.), has announced the third generation device in its Advanced Memory Buffer family, the Advanced Memory Buffer Plus (AMB+), which is said to offer the lowest power consumption available in the industry today - up to forty percent power savings over competitive AMB offerings. Compliant with the JEDEC AMB specifications, the IDT AMB+ device is an essential building block in Fully Buffered Dual In-line Memory Modules (FB-DIMM) for high-performance, low-power computing platforms.
The IDT AMB+ meets the increasing memory storage requirements of servers and workstations that must achieve higher performance to support the demands of e-commerce, web-hosting, enterprise and other mission-critical applications. The challenge for these computing platforms is to continue to scale memory performance and capacity, while reducing power consumption to fit within the tightening constraints of ever-growing data centres. The AMB+ located on each FB-DIMM collects and distributes the data from or to a DIMM, buffers the data internally on the chip, and receives or forwards it to the next DIMM or memory controller

Designed from the start in anticipation of the power concern surrounding data centers, the AMB+ reduces memory subsystem power consumption by up to forty percent, enabling increased compute capacity within existing infrastructure, while reducing operating expenditure. In addition to savings derived directly from low power consumption, the collateral reduction of thermal levels significantly reduces system cooling requirements, allowing deployment of low-noise cooling mechanisms in servers, which has not been practical until now.

The IDT AMB+ is a drop-in, ready-to-use solution that immediately provides twenty-five percent savings over previous solutions, even while operating with DDR2-800 DRAMs. Additional power savings can be achieved by special provisioning incorporated in the device, such as an optional 1.5V core power supply, instead of traditional 1.8V. Consequently, a full-module heat-spreader may no longer be necessary, significantly reducing bill of material costs and increasing packing density.






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