Memory

Displaying 531 - 540 of 604

Innovative Silicon To Present Floating Body Memory Array Results At ISSCC

Innovative Silicon, Inc. (ISi), developer of the Z-RAM zero-capacitor floating body memory technology has announced the upcoming delivery of a presentation titled “A 2ns-Read-Latency 4MB Embedded Floating Body Memory Macro in 45nm SOI Technology” in collaboration with AMD at the International Solid State Circuits Conference (ISSCC).
4th February 2009

Ramtron announces low power 256-Kilobit Serial F-RAM

Ramtron announces low power 256-Kilobit Serial F-RAM
Ramtron has announced the FM24L256, a 256Kb, 2.7- to 3.6-volt nonvolatile F-RAM memory device with a high-speed serial I2C memory interface. The FM24L256 provides high-performance data collection in a tiny, 8-pin package, cutting costs and board space in a range of applications from multi-function printers to industrial motor controllers.
2nd February 2009

Ramtrom's FM22LD16 FBGA package option for 4-megabit parallel nonvolatile F-RAM memory

Ramtrom's FM22LD16 FBGA package option for 4-megabit parallel nonvolatile F-RAM memory
Ramtron has announced the availability of its 4-megabit (Mb) F-RAM memory in a streamlined FBGA package. The FM22LD16 is a 4Mb, 3-volt, parallel nonvolatile RAM in a 48-pin ball grid array (FBGA) package that features fast access, virtually unlimited read/write cycles and low power consumption. Pin-compatible with asynchronous static RAM (SRAM), the FM22LD16 targets industrial control systems such as robotics, network and data storage applications, multi-function printers, auto navigation systems and a host of other SRAM-based system designs. Ramtron’s 4Mb parallel F-RAM is also available in a 44-pin thin small outline plastic (TSOP) package.
21st January 2009


Microchip's Stand-Alone Serial SRAM Devices

Microchip's Stand-Alone Serial SRAM Devices
Microchip has announced a family of 8- and 32-kByte stand-alone serial SRAM devices designed to increase a system’s available RAM through adding small, inexpensive external devices. The 23A640, 23K640 (23 x 640), 23A256 and 23K256 (23 x 256) devices feature a familiar, industry standard SPI interface, providing increased design flexibility while reducing design and production costs.
21st January 2009

Toshiba, IBM, and AMD Claim World’s Smallest FinFET SRAM Cell with High-k/Metal Gate

Toshiba, IBM, and AMD Claim World’s Smallest FinFET SRAM Cell with High-k/Metal Gate
Toshiba Corporation, IBM, and AMD have announced that they have together developed a Static Random Access Memory (SRAM) cell that has an area of only 0.128 square micrometers (μm2), the world’s smallest functional SRAM cell that makes use of fin-shaped Field Effect Transistors (FinFETs).
9th January 2009

Serial EEPROMs With Built-in MAC Addresses From Microchip

Serial EEPROMs With Built-in MAC Addresses From Microchip
Microchip has announced a family of serial EEPROM devices with built-in EUI-48 and EUI-64 compatible MAC addresses. Designed to work on standard buses, such as SPI, I2C and the UNI/O bus, the devices provide easy and inexpensive access to MAC addresses and feature up to 1.5Kbit of EEPROM that can be used for storing configuration and user settings, or as a scratch-pad area for buffering small amounts of data.
12th December 2008

16GB microSDHC from Toshiba

16GB microSDHC from Toshiba
Toshiba Electronics Europe (TEE) has reinforced its memory card line-up with the launch of a 16GB microSDHC card offering the largest capacity available in the market. At the same time, the company extended its range of industry-leading memory card solutions by adding ultra fast read/write 8GB and 16GB SDHC cards to its line-up. Mass production of the new SDHC cards will start in December, with production of the new microSDHC due to start in January 2009.
4th December 2008

Ramtron adds serial 512-kilobit F-RAM to V-Family product line

Ramtron adds serial 512-kilobit F-RAM to V-Family product line
Ramtron International has announced the second serial device in a family of new F-RAM products that offer high-speed read/write performance, low voltage operation, and optional device features. The FM25V05 is a 512-kilobit (Kb), 2.0V to 3.6V, serial peripheral interface (SPI) nonvolatile RAM in an 8-pin SOIC package that features fast access, NoDelay writes, 1E14 read/write cycles, and low power consumption. The FM25V05 is an ideal alternative to serial Flash and serial EEPROM memory in industrial control, metering, medical, automotive, military, gaming, and computing applications, among others. In addition to the 512Kb FM25V05, the recently announced 1-megabit FM25V10 is also available.
13th November 2008

Ramtron announces faster and power flexible 1-megabit parallel F-RAM

Ramtron announces faster and power flexible 1-megabit parallel F-RAM
Ramtron International Corporation today launched the first parallel device in a family of new parallel and serial F-RAM products that offer higher-speed read/write performance, lower voltage operation, and optional device features. The newest device in Ramtron’s V-Family of F-RAM products is the FM28V100, a 1-megabit (Mb), 2.0V to 3.6V, parallel nonvolatile RAM in a 32-pin TSOP-I package that features fast access, NoDelay™ writes, virtually unlimited read/write cycles, and low power consumption. The FM28V100 is an ideal upgrade from 1Mb battery-backed SRAM in industrial control, metering, medical, automotive, military, gaming, and computing applications, among others. In addition to the FM28V100, Ramtron recently announced the 512Kb FM25V05 and 1Mb FM25V10 serial SPI V-Family products.
11th November 2008

Renesas Technology develops SRAM for automotive applications

Renesas Technology develops SRAM for automotive applications
Renesas Technology Europe today announced that it has commenced development of low power and fast SRAM products that are specifically suited to automotive applications. They are available as 4, 16, or 32Mbit low power SRAM and 4Mbit fast SRAM devices. Sample shipments will commence during June 2009 followed by mass production during July 2009.
4th November 2008


Memory documents


Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

European Smart Homes 2017
25th October 2017
United Kingdom London
TU-Automotive Europe 2017
6th November 2017
Germany Munich
Productronica 2017
14th November 2017
Germany Messe Munchen
Future Armoured Vehicles Survivability 2017
14th November 2017
United Kingdom London
POWER & ENERGY 2017
22nd November 2017
Rwanda Kigali