Memory
Flash management software supports non-volatile memories
HCC Embedded (HCC) has announced its collaboration with Adesto Technologies to support the new Adesto FusionHD serial flash technology. HCC’s field-proven file system products use the features of FusionHD devices to significantly improve performance and data retention, reliability, and battery life of smart IoT devices.
Secure data storage for NVIDIA’s autonomous driving platforms
Macronix International has announced that Macronix’s ArmorFlash memory is being utilised on the NVIDIA DRIVE AGX Xavier and DRIVE AGX Pegasus autonomous vehicle computing platforms. ArmorFlash brings secure, quality, and longevity of supply data storage to the demanding, competitive market for artificial intelligence (AI)-based Level 2+ advanced driver assistance systems (ADAS) through Level 5 autonomous driving (AD) solutions.
New RM5 series of value SAS SSDs approved for vSAN 6.7 customers
Toshiba Memory Europe has announced that a VMware vSAN 6.7 certification has been earned for its RM5 Series of value SAS SSDs running on HPE ProLiant Gen10 servers. The 12 gigabits per second (Gb/s) RM5 Series with VMware vSAN 6.7 and VMware ESXi 6.7 certification is now listed in the VMware Compatibility Guide and available through the same channels in which HPE ProLiant servers are sold.
FPGA-based NVMe accelerators to include EDSFF
BittWare, a Molex Company, has announced a strategic investment and collaboration with Eideticom. The BittWare Computational Storage portfolio adheres to industry standard PCIe, U.2 and EDSFF form factors.
Compact dual-die memory chip supports NXP
Winbond Electronics has announced that its SpiStack dual-die NOR+NAND code storage product has been included on NXP Semiconductors FRWY-LS1012A board for use with its Layerscape LS1012A communications processor.
Serial memory controller for data centre computing
As the computational demands of artificial intelligence (AI) and machine learning workloads accelerate, traditional parallel attached DRAM memory has presented a major roadblock for next-generation CPUs, which require an increased number of memory channels to deliver more memory bandwidth.
Enhancing system architecture implementation for AI applications
As artificial intelligence (AI) processing moves from the cloud to the edge of the network, battery powered and deeply embedded devices are challenged to perform AI functions, like computer vision and voice recognition. Microchip Technology, via its Silicon Storage Technology (SST) subsidiary, is addressing this challenge.
Differential DIMM at Flash Memory Summit
SMART Modular Technologies has announced that it is showcasing its Open Memory Interface (OMI) DDR4 Differential DIMM (DDIMM) at this week’s 2019 Flash Memory Summit in Santa Clara, California. SMART Modular joined a growing roster of technology organisations (in August) contributing to the OpenCAPI Consortium, working collaboratively to drive data centre server innovation.
High capacity NVMe Solid State Drives available in 2280 form factor
Greenliant has started sampling its NVMe M.2 ArmourDrive Solid State Drive (SSD) modules to customers requiring high performance, high capacity removable data storage that can withstand extreme environments. The new industrial temperature (-40°C to +85°C) 88 PX Series NVMe M.2 ArmourDrive SSDs use 3-bits-per-cell (TLC) 3D NAND flash memory and are built in the widely used 2242 and 2280 form factors.
Storage class memory solution to reduce latency
Toshiba Memory has announced the launch of a new Storage Class Memory (SCM) solution: XL-FLASH. Based on the company’s innovative BiCS FLASH 3D flash memory technology with 1bit-per-cell SLC, XL-FLASH brings low latency and high performance to data centre and enterprise storage.