Memory

Displaying 11 - 20 of 593

Apacer launches NVMe PCIe SSD

Apacer launches NVMe PCIe SSD
In response to consumer needs for faster big data processing and real-time computing, Apacer Technology has launched the industrial-grade PM110-M280, a high-performance PCIe SSD suitable for cloud computing, IoT, and virtual environments. This enterprise SSD features a PCIe Gen3 x4 interface for faster transmission speeds and supports industry-leading NVMe, greatly improving IOPS and low latency performance and pushing through the bottleneck of previous AHCI standards to fully maximise performance.
14th July 2017

World’s first 3D flash memory comes with TSV technology

World’s first 3D flash memory comes with TSV technology
Toshiba Memory has announced development of the world’s first BiCS FLASH three-dimensional (3D) flash memory utilising Through Silicon Via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC) technology. Shipments of prototypes for development purposes started in June, and product samples are scheduled for release in the second half of 2017. The prototype of this ground-breaking device will be showcased at the 2017 Flash Memory Summit in Santa Clara, California, United States, from August 7-10.
11th July 2017

Company reaches key industrial MLC flash memory milestone

Company reaches key industrial MLC flash memory milestone
Manufacturer of flash memory solutions, Swissbit, has reached a key milestone with its MLC technology durabit. In December 2016, for the first time, a third of all flash products sold by Swissbit were based on MLC (Multi Level Cell). At the same time, sales of SLC products (Single Level Cell) also increased, firmly establishing Swissbit as a leading provider of industrial flash memory products. Traditionally, demanding applications in industrial, tele-communications and medical technology were the sole domain for SLC-based storage products.
11th July 2017


SD-Speicher bieten intelligentes Design & robuste Bauweise

SD-Speicher bieten intelligentes Design & robuste Bauweise
Nexus Industrial Memory hat in Zusammenarbeit mit Datakey kürzlich ein Whitepaper über die industrielle Nutzung von SD-Speicher verfasst, welches die wichtigsten Unterschiede zwischen den verfügbaren Lösungen betrachtet. Es wird erörtert, welche die sinnvollste Herangehensweise ist, um SD-Speicher unter besonders rauen und fordernden Umgebungsbedingungen einsetzen zu können und dabei häufig auftretende Probleme zu vermeiden.
10th July 2017

Anti-vibration fill now available in RAM modules

Anti-vibration fill now available in RAM modules
Cervoz offers value-added technology, Anti-Vibration Fill, to enhance the robustness of their DRAM modules. The new technology is available exclusively from Display Solutions in the UK. In real-world industrial computing applications, embedded devices are installed in harsh environments with constant shock or vibrations. The RAM modules inside these devices may be vulnerable to these impacts, causing poor contact and connection.
10th July 2017

3D chip merges computing with data storage

3D chip merges computing with data storage
As embedded intelligence is finding its way into ever more areas of our lives, fields ranging from autonomous driving to personalised medicine are generating huge amounts of data. But just as the flood of data is reaching massive proportions, the ability of computer chips to process it into useful information is stalling. Now, researchers at Stanford University and MIT have built a new chip to overcome this hurdle.
6th July 2017

3D flash memory adds layers and boosts capacity

A prototype sample of 96-layer BiCS FLASH three-dimensional (3D) flash memory with a stacked structure has been developed by Toshiba Memory, with 3-bit-per-cell (triple-level cell, TLC) technology. Samples of the new 96-layer product, which is a 256 gigabit (32 gigabytes) device, are scheduled for release in the second half of 2017 and mass production is targeted for 2018. The new device meets market demands and performance specifications for applications that include enterprise and consumer SSD, smartphones, tablets and memory cards.
29th June 2017

QLC 3D flash memory achieves 1.5TB capacity

QLC 3D flash memory achieves 1.5TB capacity
  Toshiba Memory has announced development of the what it claims to be the world’s first BiCS FLASH three-dimensional (3D) flash memory with a stacked cell structure. The newest BiCS FLASH device is the first to deliver 4-bit-per-cell (quadruple-level cell, QLC) technology, advancing capacity beyond that of triple-level cell (TLC) devices and pushing the boundaries of flash memory technology.
28th June 2017

256k nvSRAMs sampled for extended temperature ranges

256k nvSRAMs sampled for extended temperature ranges
  Non-volatile memory products specialist Anvo-Systems Dresden, has provided samples of the ANV32C81ASE66nvSRAM (non-volatile SRAM) for an extended temperature range of -40 to 105°C and the ANV32C81ASA66nvSRAM even for -40 to 125°C.
27th June 2017

HDD delivers high mission critical disk drive performance

HDD delivers high mission critical disk drive performance
A family of 15,000rpm enterprise performance hard disk drives for mission critical servers and storage has been announced by Toshiba Electronics Europe (TEE). With a new 900GB capacity model, the AL14SX series HDD series features a 50% capacity increase and superior performance and power savings compared to Toshiba’s prior AL13SX generation. The AL14SX series is available in 300, 600 and 900GB capacities in a compact 2.5", 15mm form-factor, saving rack space and reducing mission critical storage footprint as well as operational burden.
16th June 2017


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SPE Offshore Europe 2017
5th September 2017
United Kingdom Aberdeen Exhibition & Conference Centre
EPE 2017 ECCE Europe
11th September 2017
Poland Warsaw
ON Semiconductor Power Seminars 2017
11th September 2017
United Kingdom
DSEI 2017
12th September 2017
United Kingdom ExCeL, London
RWM 2017
12th September 2017
United Kingdom NEC, Birmingham